HFD-C (C-Shape Diamond Micron Powder)

Product Characteristics: Economic type product with irregular shape and normal PSD.

Recommended Applications: Lapping, grinding or polishing on: PCD, ceramics, stone and other workpieces.

HFD-3DW (JR3 Diamond Powder for Diamond Wire)

Product Characteristics: Made of high-strength,high-purity diamond,after special shaping.grading process,with narrow PSD,which improves theeffectivecultingforee particle content,and enhances wear resistance.

Recommended Applications: Suitable for manufacturing of diamond wire cutting tools,and rough grinding,fine grinding and polishing of brittle materials such as silicon wafers,gem stones,quartz,liquid crystal glass,magnetic materials and semiconductors,etc.

Coated Diamond Powder

Product Introduction: Includes electro-coated and chemical-coated.In general,mainly coated by nickel(Ni),titanium(TI),copper(Cu)these three coating materials to improve the retention and reduce heat damage.This coating also protects diamond from oxidation or graphitization and effectively extends the tools using life.

HFD-MC

Available size>2μm,the surface structure is rough and multiple-cutting-edge,which enhances the bondina strength and imoroving the sharoness;

Application: Ultra-precision, grinding and polishing of sapphire,magnetic head,hard disk,hard glass and crystal,ceramic and hard alloy.as additive of coating film for metal molds,tools and parts etc,polishing liquid for grinding,making tools and not easy to crack when cutting.

HFD-B (B-Shape Diamond Micron Powder)

Product Characteristics: Blocky shape, narrow PSD, low impurities (inner and outer).

Recommended Applications: Cutting, lapping, grinding and polishing on: silicon glass, optical glass, ceramic, and etc.