HFD-4DW (JR4 Diamond Powder for Diamond Wire)-Henan Huifeng Diamond Co., Ltd.

HFD-4DW (JR4 Diamond Powder for Diamond Wire)

Product Characteristics: Made of high-strength,high-purity diamond,after special shaping,grading process,with narrow PSD,which improves the effeetive cutting force particle content,and enhances wear resistance.

Recommended Applications: Suitable for manufacturing of diamond wire cutting tools,and rough grinding,fine grinding and polishing and other high-precision workpiece processing of brittle materials such as silicon wafers,gem stones, quartz,liquid crystal glass,magnetic materials and semiconductors,etc.

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Relatedproducts

HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-CA (Agglomerated Diamond Powder Series)

Product Characteristics: The product is made into spherical particles by special process,and the particle shape is regular and uniform.The particle has good wear resistance,high grinding removal efficiency, and multi-edge structure,which is not easy to cause severe scratch.protects diamond from axidation or graphitization and effectively extends the tools using life.

Recommended Applications: The product has a special material structure,widely used in precision grinding and polishing of hard and brittle materials such as sapphire wafer,SiC wafer,precision ceramics and functional glass,etc.

Coated Diamond Powder

Product Introduction: Includes electro-coated and chemical-coated.In general,mainly coated by nickel(Ni),titanium(TI),copper(Cu)these three coating materials to improve the retention and reduce heat damage.This coating also protects diamond from oxidation or graphitization and effectively extends the tools using life.

HFD-PD (Polycrystalline Diamond Powder Series)

Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.

HFD-4PCD (JR4 Diamond Powderfor PCD)

Product Characteristics: Made by MBD8 series of high-quality diamond,with high wear resistance,high purity,high strength,blocky shape,which is beneficialto the sintering growth of the products of PDC and PCD.

Recommended Applications: PCD cutting tools,PDC for coal mine and petroleum,wire drawing die,electroplating die, metal bond &vitrified bond products,etc.,which are applicable to the processing of superhard materials products with higher wear resistance.

HFD-SC

Available size>2μm,slightly pitting corrosion structure to ensure the toughness of the micropowder, and enhanaing its holding power.

Application: Widely applied to electroplating tools,can greatly improve diamond bonding strength, surface wear resistance,surface hardness and extend tool's life.

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