HFD-NPCD (New Diamond Powder Specialized for PCD)-Henan Huifeng Diamond Co., Ltd.

HFD-NPCD (New Diamond Powder Specialized for PCD)

Product Characteristics: Made by high strength MBD6 series high-quality diamond, with high wear resistance, the circularity ≥0.95, with ultra-high purity, adopting a new purification method, through special production process and particle surface cleanliness treatment, with very blocky shape, single element concentration ≤ 6-8ppm, total element concentration ≤20ppm.

Recommended Applications: High-end PDC, PCD,wire drawing die, electroplating abrasives, ceramics and metal bonding abrasives, etc.

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Relatedproducts

HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-B (B-Shape Diamond Mesh Powder)

Product Characteristics: Blocky shape, narrow PSD, low impurities (inner and outer).

Recommended Applications: Cutting, lapping, grinding and polishing on: silicon glass, optical glass, ceramic, and etc.

HFD-DC

Available size>10μm,and the diamond powders are internally foamed then form a porous structure,can increases the specific surface area of powder,improves the self-sharpness of the abrasive tool, reduces the cutting damage effectively and improves the surface processing quality.

HFD-PD (Polycrystalline Diamond Powder Series)

Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.

HFD-DW (Diamond Micron Powder Specialized For Diamond Wire)

Product Characteristics: Made of high toughness MBD diamond, treated by special re-shaping and grading, strictly removing oversize particles; good particle morphology and strictly narrow PSD,high content of effective grinding particles to enhance wear- resistance.

Recommended Applications: Making diamond wire and other cutting tools; grinding and polishing on: monocrystalline and polycrystalline silicon,precious stones, quartz, LCD glass, magnetic materials, semiconductors and other hard and friable material.

HFD-T (High Toughness Diamond Micron Powder)

Product Characteristics: Made of higher quality diamond with higher toughness and purity, blocky shape, narowPSD,tiny impurities (inner and outer); good thermal stability and high wearresistance.

Recommended Applications: Metal bond, vitrified bond products; high grade diamond paste and pollshing compound, eto.Grinding and polishing on: optical glass, fine ceramics gem stone, etc.

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