HFD-PCD (Diamond Micron Powder Specialized For PCD)-Henan Huifeng Diamond Co., Ltd.

HFD-PCD (Diamond Micron Powder Specialized For PCD)

Product Characteristics: Made of higher toughness MBD diamond, treated by special processing and with purified diamond surface; blocky shape, good thermal stability and high wear-resistance. Good for sintering growth of PDCand PCD.

Recommended Applications: PDC,PCD, wiring dies, electroplating, vitrified & metal bonded tools, etc.

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HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-PD (Polycrystalline Diamond Powder Series)

Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.

HFD-T (High Toughness Diamond Mesh Powder)

Product Characteristics: Made of higher quality diamond with higher toughness and purity, blocky shape, narowPSD,tiny impurities (inner and outer); good thermal stability and high wearresistance.

Recommended Applications: Metal bond, vitrified bond products; high grade diamond paste and pollshing compound, eto.Grinding and polishing on: optical glass, fine ceramics gem stone, etc.

HFD-DW (Diamond Micron Powder Specialized For Diamond Wire)

Product Characteristics: Made of high toughness MBD diamond, treated by special re-shaping and grading, strictly removing oversize particles; good particle morphology and strictly narrow PSD,high content of effective grinding particles to enhance wear- resistance.

Recommended Applications: Making diamond wire and other cutting tools; grinding and polishing on: monocrystalline and polycrystalline silicon,precious stones, quartz, LCD glass, magnetic materials, semiconductors and other hard and friable material.

HFD-3PCD (JR3 Diamond Powder for PCD)

Product Characteristics: Made by MBD8 series of high-quality diamond,with high wear resistance,high purity,high strength,blocky shape,which is beneficial to the sintering growth of the products of PDC and PCD.

Recommended Applications: PCD cutting tools,PDC for coal mine and petroleum,wire drawing die,electroplating die, metal bond &vitrified bond products,etc.

HFD-MC

Available size>2μm,the surface structure is rough and multiple-cutting-edge,which enhances the bondina strength and imoroving the sharoness;

Application: Ultra-precision, grinding and polishing of sapphire,magnetic head,hard disk,hard glass and crystal,ceramic and hard alloy.as additive of coating film for metal molds,tools and parts etc,polishing liquid for grinding,making tools and not easy to crack when cutting.

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