HFD-DW (Diamond Micron Powder Specialized For Diamond Wire)-Henan Huifeng Diamond Co., Ltd.

HFD-DW (Diamond Micron Powder Specialized For Diamond Wire)

Product Characteristics: Made of high toughness MBD diamond, treated by special re-shaping and grading, strictly removing oversize particles; good particle morphology and strictly narrow PSD,high content of effective grinding particles to enhance wear- resistance.

Recommended Applications: Making diamond wire and other cutting tools; grinding and polishing on: monocrystalline and polycrystalline silicon,precious stones, quartz, LCD glass, magnetic materials, semiconductors and other hard and friable material.

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Relatedproducts

HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-T (High Toughness Diamond Micron Powder)

Product Characteristics: Made of higher quality diamond with higher toughness and purity, blocky shape, narowPSD,tiny impurities (inner and outer); good thermal stability and high wearresistance.

Recommended Applications: Metal bond, vitrified bond products; high grade diamond paste and pollshing compound, eto.Grinding and polishing on: optical glass, fine ceramics gem stone, etc.

HFD-C (C-Shape Diamond Mesh Powder)

Product Characteristics: Economic type product with irregular shape and normal PSD.

Recommended Applications: Lapping, grinding or polishing on: PCD, ceramics, stone and other workpieces.

HFD-3PCD (JR3 Diamond Powder for PCD)

Product Characteristics: Made by MBD8 series of high-quality diamond,with high wear resistance,high purity,high strength,blocky shape,which is beneficial to the sintering growth of the products of PDC and PCD.

Recommended Applications: PCD cutting tools,PDC for coal mine and petroleum,wire drawing die,electroplating die, metal bond &vitrified bond products,etc.

HFD-MC

Available size>2μm,the surface structure is rough and multiple-cutting-edge,which enhances the bondina strength and imoroving the sharoness;

Application: Ultra-precision, grinding and polishing of sapphire,magnetic head,hard disk,hard glass and crystal,ceramic and hard alloy.as additive of coating film for metal molds,tools and parts etc,polishing liquid for grinding,making tools and not easy to crack when cutting.

HFD-A (A-Shape Diamond Micron Powder)

Product Characteristics: Very blocky shape, strictly narrow PSD, tiny impurities (inner and outer); better dispersion and high wear-resistence.

Recommended Applications: Recommended Applications: Metal bonded products, electroplated diamond products; grinding and polishing on: precise machinery, optical glass, fine ceramics, gem stone, semi-conductor and etc.

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