HFD-A (A-Shape Diamond Mesh Powder)

Product Characteristics: Very blocky shape, strictly narrow PSD, tiny impurities (inner and outer); better dispersion and high wear-resistence.

Recommended Applications: Metal bonded products, electroplated diamond products; grinding and polishing on: precise machinery, optical glass, fine ceramics, gem stone, semi-conductor and etc.

HFD-B (B-Shape Diamond Mesh Powder)

Product Characteristics: Blocky shape, narrow PSD, low impurities (inner and outer).

Recommended Applications: Cutting, lapping, grinding and polishing on: silicon glass, optical glass, ceramic, and etc.

HFD-DC

Available size>10μm,and the diamond powders are internally foamed then form a porous structure,can increases the specific surface area of powder,improves the self-sharpness of the abrasive tool, reduces the cutting damage effectively and improves the surface processing quality.

HFD-PD (Polycrystalline Diamond Powder Series)

Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.

HFD-4DW (JR4 Diamond Powder for Diamond Wire)

Product Characteristics: Made of high-strength,high-purity diamond,after special shaping,grading process,with narrow PSD,which improves the effeetive cutting force particle content,and enhances wear resistance.

Recommended Applications: Suitable for manufacturing of diamond wire cutting tools,and rough grinding,fine grinding and polishing and other high-precision workpiece processing of brittle materials such as silicon wafers,gem stones, quartz,liquid crystal glass,magnetic materials and semiconductors,etc.