HFD-C(C-Shape Diamond Micron Powder)-Henan Huifeng Diamond Co., Ltd.

HFD-C (C-Shape Diamond Micron Powder)

Product Characteristics: Economic type product with irregular shape and normal PSD.

Recommended Applications: Lapping, grinding or polishing on: PCD, ceramics, stone and other workpieces.

Relatedproducts

HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-B (B-Shape Diamond Micron Powder)

Product Characteristics: Blocky shape, narrow PSD, low impurities (inner and outer).

Recommended Applications: Cutting, lapping, grinding and polishing on: silicon glass, optical glass, ceramic, and etc.

HFD-A (A-Shape Diamond Micron Powder)

Product Characteristics: Very blocky shape, strictly narrow PSD, tiny impurities (inner and outer); better dispersion and high wear-resistence.

Recommended Applications: Recommended Applications: Metal bonded products, electroplated diamond products; grinding and polishing on: precise machinery, optical glass, fine ceramics, gem stone, semi-conductor and etc.

HFD-3DW (JR3 Diamond Powder for Diamond Wire)

Product Characteristics: Made of high-strength,high-purity diamond,after special shaping.grading process,with narrow PSD,which improves theeffectivecultingforee particle content,and enhances wear resistance.

Recommended Applications: Suitable for manufacturing of diamond wire cutting tools,and rough grinding,fine grinding and polishing of brittle materials such as silicon wafers,gem stones,quartz,liquid crystal glass,magnetic materials and semiconductors,etc.

HFD-4DW (JR4 Diamond Powder for Diamond Wire)

Product Characteristics: Made of high-strength,high-purity diamond,after special shaping,grading process,with narrow PSD,which improves the effeetive cutting force particle content,and enhances wear resistance.

Recommended Applications: Suitable for manufacturing of diamond wire cutting tools,and rough grinding,fine grinding and polishing and other high-precision workpiece processing of brittle materials such as silicon wafers,gem stones, quartz,liquid crystal glass,magnetic materials and semiconductors,etc.

HFD-CA (Agglomerated Diamond Powder Series)

Product Characteristics: The product is made into spherical particles by special process,and the particle shape is regular and uniform.The particle has good wear resistance,high grinding removal efficiency, and multi-edge structure,which is not easy to cause severe scratch.protects diamond from axidation or graphitization and effectively extends the tools using life.

Recommended Applications: The product has a special material structure,widely used in precision grinding and polishing of hard and brittle materials such as sapphire wafer,SiC wafer,precision ceramics and functional glass,etc.

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