Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.
Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.
HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.
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