HFD-MC-Henan Huifeng Diamond Co., Ltd.

HFD-MC

Available size>2μm,the surface structure is rough and multiple-cutting-edge,which enhances the bondina strength and imoroving the sharoness;

Application: Ultra-precision, grinding and polishing of sapphire,magnetic head,hard disk,hard glass and crystal,ceramic and hard alloy.as additive of coating film for metal molds,tools and parts etc,polishing liquid for grinding,making tools and not easy to crack when cutting.

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Relatedproducts

HuiFeng Diamond is the first launch product strategy of "Ultra-pure, Ultra-fine, Super-precision, Super-hard, Stable quality", and created eight series products: General series diamond micron powder, Special series diamond micron powder, Fetured series diamond micron powder, Crushed and Reshaped series diamond micron powder, Super-hard JR3 series diamond micron powder, Super-hard JR4 series diamond micron powder, Modified Quasi-polycrystal series diamond micron powder, and other new series diamond micron powder.

HFD-CA (Agglomerated Diamond Powder Series)

Product Characteristics: The product is made into spherical particles by special process,and the particle shape is regular and uniform.The particle has good wear resistance,high grinding removal efficiency, and multi-edge structure,which is not easy to cause severe scratch.protects diamond from axidation or graphitization and effectively extends the tools using life.

Recommended Applications: The product has a special material structure,widely used in precision grinding and polishing of hard and brittle materials such as sapphire wafer,SiC wafer,precision ceramics and functional glass,etc.

HFD-PD (Polycrystalline Diamond Powder Series)

Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.

Coated Diamond Powder

Product Introduction: Includes electro-coated and chemical-coated.In general,mainly coated by nickel(Ni),titanium(TI),copper(Cu)these three coating materials to improve the retention and reduce heat damage.This coating also protects diamond from oxidation or graphitization and effectively extends the tools using life.

HFD-DC

Available size>10μm,and the diamond powders are internally foamed then form a porous structure,can increases the specific surface area of powder,improves the self-sharpness of the abrasive tool, reduces the cutting damage effectively and improves the surface processing quality.

HFD-A (A-Shape Diamond Micron Powder)

Product Characteristics: Very blocky shape, strictly narrow PSD, tiny impurities (inner and outer); better dispersion and high wear-resistence.

Recommended Applications: Recommended Applications: Metal bonded products, electroplated diamond products; grinding and polishing on: precise machinery, optical glass, fine ceramics, gem stone, semi-conductor and etc.

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