Product Characteristics: The surface of the particle has a large number of sharp cutting edges,it has a high removal rate and self-sharpness at grinding and polishing,compared with single crystal diamond, less likely to cause surface scratch.

Recommended Applications: Widely used in precision grinding and pollishing of sapphire wafer,SICwafer,ceramic materials and other hard and brittle materials;and grinding and polishing of stainless steel,aluminum alloy and other metal materials.